3D packaging: Leti unveils a test pattern library

Leti now offers partner businesses and universities an expansive library of 3D test patterns, built from the laboratory’s years of research on 3D stacking technology. The library can be used to test the performance of various interconnections and check compliance with specifications—from the very outset.
The patterns can be used to test through-silicon vias (TSVs), or vertical connections through stacked chips, as well as the interconnections between different components. The first organizations to use the library are the European Organization for Nuclear Research and EADS subsidiary Cassidian. For other research laboratories, Leti plans to offer test patterns that can be easily embedded on customers’ wafers.

Contact: chantal.chantre@cea.fr

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