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February 04 2013

Atom probe tomography getting closer to artefact-free 3D reconstruction

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Under the French National Research Agency (ANR) Aptitude program, which kicked-off in January 2013, Leti plans to develop artefact-free 3D reconstruction methods for atom probe tomography. The research will lay the groundwork for the future 14 nm technology node and its new FINFET architectures and FD-SOI transistors. Scientists will need new characterization tools if they […] >>

February 04 2013

Nanomedicine: ETPN appoints new Executive Committee

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Patrick Boisseau, head of CEA-Leti’s nanomedicine program, was elected President of the European Technology Platform for Nanomedicine (ETPN) on December 5, 2012. The new Vice President, also French, is Nanobiotix CEO Laurent Lévy. Founded in 2005, ETPN is coordinated by the European Commission and industry representatives to promote nanotechnology applications in medicine. The organization serves […] >>

February 04 2013

Micro and nanoelectronics design: Grenoble Institute of Technology to propose new apprenticeship program

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In March, Grenoble Institute of Technology will present its pioneering new three-year initial training program to the Rhône-Alpes regional government. The new program would give micro and nanoelectronics design students hands-on learning opportunities through apprenticeships with companies in the industry. And Grenoble is home to a substantial number of high-tech companies—STMicroelectronics, Dolphin Integration, Asygn, Tiempo, […] >>

February 04 2013

Grenoble Institute of Technology moves up in rankings

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The 2013 L’Etudiant-L’Express engineering school rankings were published in mid-December 2012. Grenoble Institute of Technology-Phelma moved up four slots from the previous year. Ranked 17th out of around 100 schools, Phelma tied with the Ecole des Mines in Nancy and another Grenoble Institute of Technology school, Ensimag. Even though the rankings were tight, the school’s […] >>

February 04 2013

Spintec reinvents the electronic compass

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Spintec has just completed the first prototype of its patented integrated 3D compass. This innovation stands to overturn the existing technology, which uses costly and difficult-to-assemble discrete components. Spintec’s prototype uses a pyramid-shaped chip containing four magnetoresistive sensors, one on each side of the pyramid, to obtain the three components required for the local magnetic […] >>
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