News :
April 01 2019
Bernard Dieny earns IEEE recognition
- MINATEC
- News
- Research
The IEEE Magnetics Society Career Achievement Award 2019 was given to IRIG (formerly INAC) researcher and Spintec cofounder Bernard Dieny in Washington. The award has traditionally gone to the greatest minds in international magnetism research: Bernard Dieny is certainly no exception, with a total of 430 publications and 70 patents to his name. He played […] >>
April 01 2019
Student entrepreneurs: Phelma engineering school home to four projects
- Education
- Industry
- Innovation & Society
- News
The French government created a special “student entrepreneur” status in 2014, and students at Grenoble Institute of Technology’s Phelma engineering school continue to take advantage of it! This year, the school is home to four projects led by five second- and third-year students. The student entrepreneurs are receiving support from OZER, an organization set up […] >>
April 01 2019
EuroSOI-Ulis conference reaches out to broader audience
- Industry
- Life @ MINATEC
- MINATEC
- News
- Research
The fifth combined EuroSOI-Ulis conference will be held on April 1 to 3 at Maison MINATEC. EuroSOI is right up there with S3S (held in the United States) as one of the world’s top SOI* events. This year’s EuroSOI will address topics including the most advanced form of SOI, FDSOI, and radiofrequency applications for SOI. […] >>
April 01 2019
It’s amazing what a little spin pumping can do
- News
- Research
In 2016 researchers at Spintec used spin pumping to study spin fluctuations in ultra-thin layers. More recently, they joined forces with other researchers* to show that the method is generic in nature. In other words, it is effective regardless of whether an electric or magnonic current is used to transport the spin and regardless of […] >>
April 01 2019
Retina: 3D-integrated image processing
- News
- Research
Researchers from Leti made a significant technological advance when they completed the 3D integration of a 1024 x 768 pixel imager and a 192 multicore-processor chip. The two components are stacked and physically and electrically connected by direct bonding of their metal layers. The pixels integrate the read and scan electronics. The 3D assembly enables […] >>