News : Industry
June 02 2014
Aryballe unveils plans to raise €4 million in fresh capital
- Industry
- News
- Research
Start-up Aryballe Technologies, founded in 2014, is gearing up to raise €4 million in fresh capital to finance R&D on innovative olfactory and gustatory biosensors for the perfume and food industries. The company has also signed two R&D contracts, one with Leti and the other with INAC. Aryballe used SPRi (Surface Plasmon Resonance imaging), a […] >>
June 02 2014
Samsung chooses FD-SOI
- Industry
- Innovation & Society
- MINATEC
- News
- Research
Grenoble’s microelectronics industry just brought home a big win. Global smartphone leader Samsung recently signed a strategic contract with STMicroelectronics with a view to integrating the semiconductor giant’s 28 nm FD-SOI technology into future generations of Samsung products. STMicroelectronics, Soitec, and Leti have been working together to improve FD-SOI over the past several years. The […] >>
June 02 2014
Books: Beyond CMOS Nanodevices 2
- Industry
- MINATEC
- News
- Research
Network of Excellence coordinator Francis Balestra (IMEP-LAHC) edited Beyond CMOS Nanodevices 2, which was recently published by Wiley. The multi-author book, a follow-up to the EU Nanofunction project on beyond-CMOS nanosystems, provides a comprehensive review of the state of the art and the flagship applications expected to emerge over the next decade. The first volume […] >>
June 02 2014
Nanometric deformation measurement just got even more accurate
- Industry
- News
- Research
The Nanocharacterization Platform has just achieved a world first: measuring SOI transistor deformation with spatial resolution under 2 nm. The breakthrough was made possible thanks to the addition of precession electron diffraction to the Titan transmission electron microscope. A set of lenses was used to rotate the beam, increasing the number of diffraction spots. The […] >>
June 02 2014
Piezoelectric stack integration time slashed by 70%
- Industry
- News
- Research
A team of researchers from Leti and Mitsubishi has developed a process that leverages a new piezoelectric material developed by Mitsubishi. According to the researchers’ estimates, the process could cut by 70% the time needed to integrate a piezoelectric stack measuring around 2 microns thick into RF capacitors and actuators. The innovation hinges upon a […] >>