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A CEA-Leti team has designed an ultra-low-power radiofrequency chip that connects fixed or mobile IoT devices to nanosatellites manufactured by the Swiss company Astrocast. Terrestrial IoT networks cover a mere 15% of the planet’s surface, meaning that this new technology is desperately needed in industries such as maritime transportation, fishing, and offshore oil, which operate […] >>

Irig researcher Ivan Duchemin has earned recognition for his work as runner-up in the annual Atos-Joseph Fourier award for advanced computing and artificial intelligence. Duchemin won a previous award for his expertise in high-performance computing in 2014. Duchemin developed ab initio algorithms to simulate and characterize unique defects in boron nitride flakes of over one […] >>

CEA-Leti and equipment manufacturer SET have developed a new hybrid die-to-wafer bonding process that boasts micron-level accuracy. The solidity of the bond is achieved using the molecular force between the copper and oxide surfaces alone. Several patents have already been filed for this now-mature technology, which will soon be brought to market in a new […] >>

CIME* Nanotech now offers multi-project circuit prototyping, which significantly lowers fabrication costs. This new service rounds out the organization’s circuit design and validation activities. In multi-project circuit prototyping, a single silicon wafer is used to prototype circuits for up to thirty clients, who each purchase a tiny amount of space on the wafer. This approach […] >>

LMGP, a recognized leader in spatial atomic layer deposition (SALD), is now using the technique for high-throughput combinatorial deposition.This technique entails depositing thin films whose thicknesses and chemical concentrations can vary from one point to another, resulting in samples with a wider spectrum of properties. It can be used in photovoltaic and display technologies.Specially designed […] >>