News : Research

Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament […] >>

This fall Grenoble Institute of Technology-Phelma will kick-off France’s first work-study program for micro and nanoelectronic systems design. This program was developed in association with Grenoble-area high-tech businesses and was approved by the regional government in April 2013. The program will give engineers the theoretical knowledge and real-world experience to design integrated systems. It aims […] >>

Aledia, a start-up spun off from Leti, has just crossed two important milestones. First, it has finished making its first series of LEDs on 200 mm silicon wafers—a breakthrough process that cuts LED production costs by a factor of four relative to conventional methods. And second, the young firm has raised €10 million of fresh […] >>

Leti’s annual gathering will be held at MINATEC on June 25–28—with one big novelty: this will be the first year of the new format, beefed up considerably relative to the Leti Annual Review. This first edition of the Leti Innovation Days will include a full program of talks and workshops on technical topics. The central […] >>

The first 14 nm microelectronic circuits won’t be produced on a large scale until 2015 or 2016—but now is when engineers need to decide which technologies they want to use. That’s why Leti has just put together a 14 nm design kit for one of its flagship technologies: fully-depleted silicon on insulator (FDSOI). The kit […] >>