News : Emerging materials and processes for nanotechnologies and microelectronics

The advance of LED micro displays requires high resolution and brightness for a wide range of applications such as smart phone or virtual reality. These new products specifications raise challenges in terms of pixels size and density, material integration and fabrication techniques. In this context, Gallium Nitride has been extensively used and studied for its […] >>

For microelectronics industry, SOI (Silicon on Insulator) structure elaboration for the new generation of integrated circuits fabrication relies on wafer bonding by molecular adherence technology. It is based on direct bonding between two surfaces thanks to plasma activation. In the Ph.D.’s framework, we propose to study and to develop new activation processes by plasma in […] >>

The SmartCut technology is nowdays widely used on the manufacture of innovative substrates such as SOI (Silicon-on-Insulator). The fundamental physical phenomena underlying this process are still being actively studied. In particular, the catastrophic fracture step, which allows the transfer of a very thin layer of a donor substrate onto a base or receiver substrate. An […] >>

In the history of semiconductors, the requirements in terms of device size have always followed a descending trend. Low thermal budget solutions are now key to manage these specifications. Within this context, nanosecond laser annealing stands as an excellent solution. Laser process conditions can be adjusted to the material structure. During heating and according to […] >>

Power electronics used in particular for the electric vehicle requires the fabrication of smaller and smaller devices able of sustaining high currents and high working voltages. The miniaturization of these components requires the development of new dielectric materials with high breakdown field. A promising approach is to combine the high dielectric constant of inorganic oxides […] >>