Fraunhofer and Leti sign novel microelectronics partnership

Berlin-based Fraunhofer Group for Microelectronics and Leti signed a new partnership agreement at Leti Innovation Days in June. The agreement will build on existing collaboration between the partners and will cover R&D projects on FDSOI and More than Moore to enable the use of next-generation components in automotive and aeronautics systems, IoT, augmented reality, and healthcare. The two institutes will join forces on these R&D projects to help ensure that France and Germany maintain their positions of leadership on the global microelectronics market.

Contact: carlo.reita@cea.fr

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