Nanocharacterization platform beefs up 3D microscopy capabilities

The MINATEC nanocharacterization platform now boasts two new state-of-the-art machines: a rapid plasma etching system using xenon ions; and a unique x-ray tomographic microscope for generating 3D images. This cutting-edge equipment will help scientists better understand and improve the reliability of large-scale 3D components.
The etching system operates some 60 times faster than conventional gallium-ion-beam systems. It can be used to prepare “large” samples measuring 100 µm x 100 µm x 100 µm. The X-ray tomographic microscope can generate images with 100 nm resolution—almost the same as that of a synchrotron. With this powerful tool, MINATEC researchers can quantify materials buried 100 µm deep, observe pore structures in silicon and fuel cells, spot defects in through-silicon vias and copper pillars, and much more.

Contact: pierre.bleuet@cea.fr

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