Retina: 3D-integrated image processing

Researchers from Leti made a significant technological advance when they completed the 3D integration of a 1024 x 768 pixel imager and a 192 multicore-processor chip. The two components are stacked and physically and electrically connected by direct bonding of their metal layers. The pixels integrate the read and scan electronics. The 3D assembly enables massively parallel interconnection of the pixels to the processor array. The demonstrator, which was given the name Retina, boasts enough processing power to handle 5,500 images per second.

The module could potentially lighten the load of a central processor by completing value-added tasks like detecting anomalies, focusing on areas of interest, and capturing moving objects, in its place. Leti has filed several patents and is currently working on a second generation of the technology.

Contact: laurent.millet@cea.fr

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