News : techtransfer

The fifth combined EuroSOI-Ulis conference will be held on April 1 to 3 at Maison MINATEC. EuroSOI is right up there with S3S (held in the United States) as one of the world’s top SOI* events. This year’s EuroSOI will address topics including the most advanced form of SOI, FDSOI, and radiofrequency applications for SOI. […] >>

The 3D-Onochip* project (run by two industrial companies and two Grenoble Institute of Technology labs** and backed by the French Single Interministerial Fund) recently reached an important milestone. Microlight3D, one of the industrial companies involved in the project, successfully printed 900 x 900 x 300 µm cytoskeletons in 96-well plates with excellent process reproducibility. LMGP […] >>

Sylvain Colomb took over from Alain Briand as head of the CEA Grenoble’s tech transfer and spinoff programs in January. Colomb, 41 years old, is an electronics engineer and has personal experience starting a spinoff. He is one of the cofounders of Ethera, spun off from the CEA in 2010 to develop indoor air quality […] >>

Yanxia Hou-Broutin, a research scientist at INAC, and Tristan Rousselle, CEO of Aryballe Technologies, came in second in the European Association of Research and Technology Organisations (EARTO) European Innovation Awards in the Impact Delivered category in Brussels last fall. The award was granted for the partners’ successful collaboration on the NeOse artificial nose. NeOse leverages […] >>

In order to promote FDSOI, their advanced CMOS technology, to Chinese manufacturers, Leti and Soitec are ready and willing to organize events in China. In late November they met with some 200 managers, technicians, and circuit designers in Shanghai. The two-day “SOI Academy” was facilitated by experts from Leti and Soitec, and featured speakers from […] >>