News : techtransfer

April 01 2018

Aledia raises €30 million and welcomes Intel

  • Industry
  • Life @ MINATEC
  • News
  • Research
Startup Aledia, which specializes in a 3D LED technology, has just completed its third round of fundraising, bringing in €30 million in fresh capital. In addition to the company’s past investors, which include Ikea, the high-profile Intel Capital has now also joined the ranks of the company’s investors. This new investor is evidence that Aledia’s […] >>

April 01 2018

2018 CEA Tech showroom guide now available

  • Industry
  • MINATEC
  • News
The 2018 CEA Tech showroom guide was published in February. The first edition of the guide came out last year. The guide, for internal use only, is designed for showroom tour leaders and business developers at the CEA Tech institutes. With nearly 300 pages of information, the guide is also a practical reference for trade […] >>

April 01 2018

BHT: Weebit Nano, a new company with great memory

  • Industry
  • Life @ MINATEC
  • News
  • Research
Israel’s Weebit Nano, which moved into the BHT in September, has been working with Leti since 2016. Their research focuses on tomorrow’s resistive memory (ReRAM), which is faster and more energy-efficient than flash memory. ReRAM also offers the advantage of being made from silicon oxide, a material very commonly used in microelectronics and easy to […] >>

April 01 2018

Chips individually encrypted during fabrication

  • Industry
  • News
  • Research
Leti and Mapper, an equipment manufacturer based in the Netherlands, recently announced a major innovation: an individual security code etched onto the metal interconnects of individual chips during fabrication. Mapper developed a multiple electron beam maskless lithography test machine, which Leti integrated into a standard 40 nm CMOS fabrication process. The machine can be adapted […] >>

April 01 2018

Pixcurve image sensor: microelectronics free from planar sensors

  • Events
  • Industry
  • Innovation & Society
  • MINATEC
  • News
In February Leti presented a functional prototype of an 11 mm x 7 mm CMOS image sensor whose unique feature is that it is curved. The innovation could lead to a spectacular reduction in the size and complexity of lenses. It also opens the door to a whole new breed of microelectronics where the flat […] >>
More information
X