News : Engineering science
May 17 2018
Theory, design methodology and experimental validation of distributed amplifiers in advanced silicon technologies
PhD POSITION Theory, design methodology and experimental validation of distributed amplifiers in advanced silicon technologies Laboratory: Research will be done at the RFIC-Lab (under creation) Supervisor: Antonio Souza, Florence Podevin & Sylvain Bourdel Phone: +33 4 56 52 95 67 E-mail: antonio.lisboa-de-souza@grenoble-inp.fr Objectives: Distributed amplifiers […] >>
May 15 2018
Pseudo-MOSFET sensors based on out-of-equilibrium potential reading
Pseudo-MOSFET sensors based on out-of-equilibrium potential reading Deadline for application: the 1st of June 2018, beginning of contract: the 1st of Oct. 2018 Place: IMEP – LAHC, MINATEC – INPG, 3, Parvis Louis Néel, 38016, Grenoble Advisor: Irina Ionica (Associate Professor Grenoble ING), Irina.Ionica@phelma.grenoble-inp.fr +33 (0) 4 56 52 95 23 Context and objectives: In […] >>
April 18 2018
Engineered BiomimEtic platforms to analyse the molecular and cellular role of Heparan Sulfate on bone morphogenetic protein 2
CONTEXTE The industrial development of biomaterials for bone tissue regeneration is steadily increasing due to socio-economical need for bone repair therapies especially caused by the aging of the population and improvement of the quality of life. A boost of bone repair can be achieved using potent osteoinductive proteins, named bone morphogenetic proteins (BMPs). In Europe, […] >>
April 17 2018
Study of the piezoelectric properties of ZnO based nanocomposites: application to energy harvesting for autonomous sensors
Study of the piezoelectric properties of ZnO based nanocomposites: application to energy harvesting for autonomous sensors IMEP-LaHC / MINATEC / Grenoble-France DEADLINE FOR APPLICATION: MAY 28th 2018 Keywords: Nanotechnologies, Nanowires, Piezoelectricity, AFM, Semiconductor Physics and technology. Description of the project: Semi-conductor piezoelectric nanowires (NWs) (of GaN or ZnO among others) have improved piezoelectric properties compared […] >>
April 11 2018
3D printed electronic for Molded Interconnected Devices (MID) dedicated to Internet of Things applications
Within the framework of a Chaire Industrielle d’Excellence MINT*, the PHD relies on a direct printing technology […] >>