News : Engineering sciences

Thesis topics 2024 Development and implementation of microwave characterization techniques for molding resins used in 3D integrated circuit packaging Contexte et objectif : Dans le cadre d’un projet IPCEI (Projets Importants d’Intérêt Européen Commun) en  collaboration avec la société STMicroelectronics, nous nous intéressons à la caractérisation  diélectrique hautes fréquences (jusque 100 GHz) de résines de […] >>

  M2 INTERSHIP Silicon Carbide microelectrode array for neural interfacing   Electric brain computer interfaces are based on electrode that collect or stimulate the neural activity. For two decades many types of intracortcial microelectrode arrays have been developed  nevertheless long lasting neural implants are still missing to allow a proper of this technology toward clinical […] >>

                                                    2 YEARS POSTDOCTORAL FELLOW POSITION                                                               Characterization of high-k dielectric/silicon interfaces                                                             using second harmonic generation  (SHG)                                                                                                 Starting date:  January- February 2024                                                                                                    Within the IPCEI (Important Project of Common European Interest) on Microelectronics, we work (in collaboration with STMicroelectronics) on the development of a non-destructive characterization method adapted for interfaces between passivation […] >>

    MASTER 2 INTERNSHIP PROPOSAL                                                               Characterization of dielectric/silicon interfaces                                                             using second harmonic generation                                                                                                      Starting date: February 2024                                                                                                     Duration: 5-6 months The microelectronics and optoelectronics industry relies on complex dielectric/silicon stacked  structures. Such structures, which are needed in cameras, displays, MOS transistors, …, must have very well-defined material properties but also […] >>

PHOTONIC PHYSICAL UNCLONABLE FUNCTIONS FOR SECURE NEUROMORPHIC PHOTONIC ACCELERATORS Application deadline  : FRIDAY 3 NOVEMBER 2023 The rising needs of processing information at the edge for low latency, high speeds, and energy efficiency purposes leveraging edge-computing as well as IoT devices (75 billion expected by 2025) for data collection and processing demands for more robust […] >>