News : Engineering sciences

Microsystems sensors (MEMS) are the interface between the physical world and the digital world, and they are present today in most components and systems. A major challenge is the development of sensors that can be interrogated remotely, without electronic circuits or batteries, which will make it possible to envisage new applications as for example in […] >>

While topics around protection mechanisms or threat detection are currently well covered, post-attack repair is still not very present in the scientific literature. Objectives: The objective of this thesis is to identify solutions to restore critical functions or tasks of an embedded device after the detection of an unwanted event (due to a malicious attack […] >>

In the Optics and Photonics division of CEA-LETI, The Emissive Components Laboratory designs and fabricates micro-displays based on GaN micro-LEDs. One of the major issue of GaN µ-LEDs is the decrease of their efficiency with the size reduction. In literature, this degradation is attributed to SRH (Shockley-Read-Hall) non-radiative recombinations on pixel sidewalls, in defects induced […] >>

The development of silicon photonics technology has made it possible to integrate numerous photonic functions on the same chip, as close as possible to electronic functions, allowing the miniaturization of components in the fields of datacoms, telecoms and optical sensors. However, optical communication from chip to chip remains a key point to be developed (in […] >>

In order to reduce the manufacturing costs of integrated circuits and continue their miniaturization, disruptive approaches based on the use of selective deposition processes are now being considered in addition to photolithography. Recent developments are mostly linked to the use of atomic layer deposition (ALD) which is a very suitable technique for the development of […] >>