Actualités :

Cadre et contexte Dans le cadre du développement de l’électronique structurelle, thématique transverse au Leti et au Liten,  la mise au point de systèmes conformables et étirables nécessite l’intégration de structures en silicium fortement amincies (puces, capteurs) dans des membranes polymères (polyuréthane, silicone) étirables de plusieurs dizaines de % . Le contraste de rigidité  entre […] >>

Context : Because it may revolutionize the high performance computing systems, nowadays, silicon quantum computing technologies receive an increasing interest. Based on quantum bit (Qubit), the large potential of those technologies stems from the use of CMOS know-how to adapt the semiconductor qubit in large scale. To achieve efficient control and read-out of qubit with […] >>

Context : Parasitic resistances and capacitances in integrated circuit produce circuit performance degradations (i.e speed and power consumption) when CMOS technologies are scaling down. They also need to be accounted accurately while designing Non Volatile Memory (NVM) advanced circuit for neuromorphic applications or high power circuit with GaN technology to anticipate heating effect. Parasitic elements […] >>

Context : 3D sequential integration enables to achieve the highest 3D contact density between stacked levels compared to other existing techniques. However it requires to process stacked devices with a limited thermal budget. Leti institute is pioneer in this domain and has a unique expertise on low temperature devices for computing applications. This internship’s goal […] >>

Context And background : LCFC Lab offers a complete RGA testing solution for outgassing and hermetic studies of microelectronic and MEMS package cavities. Two ultra high vacuum apparatus has been developed as well as a devoted software package for qualitative and quantitative RGA data analysis. To strengthen the RGA activity, software optimization and improvement is […] >>