News : DPFT

January 01 2023

Development of innovative etching processes for the integration of ferroelectric materials in non-volatile memories

Today, memories are once again a priority for two reasons: data production is growing exponentially. Data storage and transfer consumes up to 90% of the energy in computing systems. Non-volatile memories, which retain information when not powered, are needed to limit energy consumption. Ferroelectric memories (FeRAM or FRAM) are one of the emerging non-volatile memory […] >>

January 01 2023

2D layers of chalcogenide materials growth by van der Waals epitaxy for frugal electronics

Non-volatile magnetic memories (MRAMs), such as STT-MRAMs (Spin-torque Transfer MRAMs), appear to be extremely promising devices for reducing the energy consumption of memories. In this context, a very strong spin-orbit coupling at room temperature has been demonstrated in 2D heterostructures of Tellurium-based chalcogenide materials opening the way to new energy-efficient devices. On the other hand, […] >>

January 01 2023

Localized selective deposition of oxides for microelectronics

In order to reduce the manufacturing costs of integrated circuits and continue their miniaturization, disruptive approaches based on the use of selective deposition processes are now being considered in addition to photolithography. Recent developments are mostly linked to the use of atomic layer deposition (ALD) which is a very suitable technique for the development of […] >>

January 01 2023

Coupling of advanced characterization techniques to study 2D material growth and integration

Two-dimensional (2D) materials are defined as crystalline solids consisting of a single layer of atoms, making their properties remarkable. Compared to their massive form, they can present outstanding semiconducting characteristics that can be exploited for many applications (CMOS, memories, photonics, photovoltaics, etc.). However, their integration into components via standard microelectronics processes remains a challenge and […] >>
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