News : FMNT
May 15 2018
Pseudo-MOSFET sensors based on out-of-equilibrium potential reading
Pseudo-MOSFET sensors based on out-of-equilibrium potential reading Deadline for application: the 1st of June 2018, beginning of contract: the 1st of Oct. 2018 Place: IMEP – LAHC, MINATEC – INPG, 3, Parvis Louis Néel, 38016, Grenoble Advisor: Irina Ionica (Associate Professor Grenoble ING), Irina.Ionica@phelma.grenoble-inp.fr +33 (0) 4 56 52 95 23 Context and objectives: In […] >>
May 02 2018
Structure–property relations for manganite memristive devices
CONTEXT Among the various emerging devices expected to replace conventional Flash memories, Resistive Random Access Memories (ReRAM) are currently attracting a strong scientific and industrial interest. Their operations are based on the switching between a low resistive and a high resistive state, which represents the two binary states. ReRAM devices have already demonstrated significant advantages […] >>
April 18 2018
Engineered BiomimEtic platforms to analyse the molecular and cellular role of Heparan Sulfate on bone morphogenetic protein 2
CONTEXTE The industrial development of biomaterials for bone tissue regeneration is steadily increasing due to socio-economical need for bone repair therapies especially caused by the aging of the population and improvement of the quality of life. A boost of bone repair can be achieved using potent osteoinductive proteins, named bone morphogenetic proteins (BMPs). In Europe, […] >>
April 17 2018
Study of the piezoelectric properties of ZnO based nanocomposites: application to energy harvesting for autonomous sensors
Study of the piezoelectric properties of ZnO based nanocomposites: application to energy harvesting for autonomous sensors IMEP-LaHC / MINATEC / Grenoble-France DEADLINE FOR APPLICATION: MAY 28th 2018 Keywords: Nanotechnologies, Nanowires, Piezoelectricity, AFM, Semiconductor Physics and technology. Description of the project: Semi-conductor piezoelectric nanowires (NWs) (of GaN or ZnO among others) have improved piezoelectric properties compared […] >>
April 11 2018
3D printed electronic for Molded Interconnected Devices (MID) dedicated to Internet of Things applications
Within the framework of a Chaire Industrielle d’Excellence MINT*, the PHD relies on a direct printing technology […] >>