News : IMEP-LaHc
October 04 2024
Spintronics in graphene over transition metal dichalcogenides: Simulations
MASTER 2 – Duration: 6 months -Start period: February/ March 2025 Possibility of PhD thesis Context : In the context of spintronics, graphene is considered an ideal platform thanks to its very weak spin-orbit coupling (SOC), which allows spin scattering lengths of up to a few tens of micrometers [1]. For the same reason, however, […] >>
May 31 2024
Alternative methods based on dynamic detection for a new generation of ISFET-like biosensors in graphene
Alternative methods based on dynamic detection for a new generation of ISFET-like biosensors in graphene Deadline for application: 18th of June 2024, beginning of contract: 1st of Oct. 2024 Place: CROMA (Minatec) and Néel Institut, Grenoble (France) Advisors: Irina Ionica (Associate Professor Grenoble INP), Cécile Delacourt (CNRS rechercher, Néel Institut), Context and objectives: […] >>
May 29 2024
Simulation, fabrication and characterization of transparent piezoelectric transducers based on ZnO nanowires
Simulation, fabrication and characterization of transparent piezoelectric transducers based on ZnO nanowires Detailed Topic Piezoelectric devices are attracting growing interest as a micro-source of energy by harvesting mechanical ambient energy, and as sensors via the direct piezoelectric effect. In this context, semiconducting materials in the form of nanowires constitute a promising building block for the […] >>
March 19 2024
Co-Integration of Photonic Multichip Module for THz Frequency Generation
PhD Position 2024: Co-Integration of Photonic Multichip Module for THz Frequency Generation KEYWORDS : Laser, Integrated Optics, TeraHertz, Communications CONTEXT: The technological development of communications devices, new and futures uses such as video conferencing, streaming, Internet of Things (IOT), 6G, AI, continue to further increase the pressure […] >>
January 30 2024
Development and implementation of microwave characterization techniques for molding resins used in 3D integrated circuit packaging
Thesis topics 2024 Development and implementation of microwave characterization techniques for molding resins used in 3D integrated circuit packaging Contexte et objectif : Dans le cadre d’un projet IPCEI (Projets Importants d’Intérêt Européen Commun) en collaboration avec la société STMicroelectronics, nous nous intéressons à la caractérisation diélectrique hautes fréquences (jusque 100 GHz) de résines de […] >>