News : Leti

January 01 2023

Cryo-CMOS electronics: Thermal and strain effects in FDSOI MOSFETs down to very low temperature

In the context of the development of the cryo-electronics, i.e. the extension of operation of digital or analog electronics to cryogenic temperatures, down to a few tens of mK, in particular for quantum applications, the aim of the post-doctoral project is to continue the effort of modeling and characterization of the FDSOI technology at low […] >>

January 01 2023

Auto-adaptive neural decoder for clinical brain-spine interfacing

CEA/LETI/CLINATEC invite applications for postdoctoral position to work on the HORIZON-EIC project. The project goal is to explore novel solutions for functional rehabilitation and/or compensation for people with sever motor disabilities using auto-adaptive Brain-Machine Interface (BMI) / neuroprosthetics. Neuroprosthetics record, and decode brain neuronal signal for activating effectors (exoskeleton, implantable spinal cord stimulator etc.) directly […] >>

January 01 2023

Optomechanical force probes development for high speed AFM

The proposed topic is part of a CARNOT project aiming at developing a new generation of force sensors based on optomechanical transduction. These force sensors will be implemented in ultrafast AFM microscopes for imaging and force spectroscopy. They will allow to address biological and biomedical applications on sub-microsecond or even nanosecond time scales in force […] >>

January 01 2023

Design of 2D Matrix For Silicum Quantum computing with Validation by Simulation

The objective is to design a 2D matrix structure for quantum computing on silicon in order to consider structures of several hundred physical Qubits. In particular the subject will be focused on: – The functionality of the structure (Coulomb interaction, RF and quantum) – Manufacturing constraints (simulation and realistic process constraint) – The variability of […] >>

January 01 2023

Development of large area substrates for power electronics

Improving the performance of power electronics components is a major challenge for reducing our energy consumption. Diamond appears as the ultimate candidate for power electronics. However, the small dimensions and the price of the substrates are obstacles to the use of this material. The main objective of the work is to overcome these two difficulties […] >>
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